| | 2019 42nd International Conference on Telecommunications and Signal Processing (TSP)
July 1-3, 2019, Budapest, Hungary
Web: http://tsp.vutbr.cz/
Full Paper Submission: March 18, 2019 @ 6PM CET (EXTENDED DEADLINE)
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Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Hungary Section, IEEE Czechoslovakia Section, and IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter.
The TSP 2019 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #46676, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.
After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):
- Special Issue Selected Papers from the 2019 42nd International Conference on Telecommunications and Signal Processing (TSP) of an Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2017 JCR Q3; current Impact Factor: 1.689)
- International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals
- Selected high-quality papers submitted to Workshop WS1 will be invited for publication in Special Issue ?Recent Advances in Biometrics and its Applications? in Electronics journal (ISSN 2079-9292), published by MDPI and indexed by Web of Science (2017 JCR Q2; Impact Factor: 2.110)
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Dear Colleague,
You are kindly invited to participate in the 2019 42nd International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 1-3, 2019, in Budapest, Hungary.
The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.
TOPICS:
TSP 2019 has opened Call for Papers for Full Paper Submissions with an EXTENDED deadline set for March 18, 2019 @ 6PM CET. We look forward to your innovative contributions in any of the following areas:
AREA 1: Telecommunications
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement
AREA 2: Signal Processing
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing
For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .
WORKSHOPS AND SPECIAL SESSIONS:
Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2019 Conference. The following Workshop and Special Sessions were approved so far:
- WS1: 3rd International Workshop on Recent Advances in Biometrics and its Applications by Assoc. Prof. Dr. Larbi Boubchir and Prof. Boubaker Daachi (both with the LIASD ? University of Paris 8, France). Selected high-quality papers submitted to this workshop will be invited for publication in Special Issue ?Recent Advances in Biometrics and its Applications? in Electronics journal (SJR Q1, IF: 2.11).
- SS1: Special Session on Internet of Things Communication Networks by Dr. Jorge Crichigno (University of South Carolina, U.S.A.) and Dr. Gautam Srivastava (Brandon University, Canada)
- SS2: Special Session on Photonic Fibre Networks and their Applications (Theory, Design, Modeling, Operation, Trials) by Dr. Josef Vojtech (CESNET a.l.e., Czech Republic) and Dr. Tomas Horvath (Brno University of Technology, Czech Republic)
- SS3: Special Session on Signal Processing and Classification for Building Intelligent Recognition Systems by Prof. Dr. Corneliu Burileanu and As. Prof. Dr. Anamaria Radoi (both with the University Politehnica of Bucharest, Romania)
Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .
STUDENT BEST PAPER AWARD:
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.
ORGANIZERS:
The TSP 2019 is IEEE technically co-sponsored Conference organized in cooperation with eighteen universities:
- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France
- University ?Politehnica? of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (?CAMPUS?)
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland
COMMITTEES:
- Miloslav Filka, Brno University of Technology, Czech Republic ? Full Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic ? IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member - General Co-Chair
- Attila Vidacs, Budapest University of Technology and Economics, Hungary ? Deputy Head of Department - General Co-Chair
- Jiri Hosek, Brno University of Technology, Czech Republic ? IEEE Member - Publications & Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic ? IEEE Graduate Student Member - Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary ? Finance Chair
- Csilla Fulop, Asszisztencia Congress Bureau, Hungary ? Registrations Chair
Steering Committee:
- Larbi Boubchir, Universite Paris 8, France ? Associate Professor, IEEE Senior Member
- Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, Tecnocampus, Spain ? Full Professor, Dean
- Izzet Cem Goknar, Isik University, Turkey ? Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan ? Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey ? Full Professor
- Jaroslav Koton, Brno University of Technology, Czech Republic ? Vice-dean for Research, IEEE Senior Member
- Sridhar Krishnan, Ryerson University, Canada ? Full Professor & Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia ? IEEE Croatia Section Communications Chapter Chair, IEEE Member
- Antonio Luque, University of Seville, Spain ? IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member
- Shahram Minaei, Dogus University, Turkey ? Full Professor, IEEE Senior Member
- Jiri Misurec, Brno University of Technology, Czech Republic ? Full Professor, Department Chair
- Ram M. Narayanan, The Pennsylvania State University, USA ? Full Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan ? Full Professor, IEEE Senior Member
- Serdar Ozoguz, Istanbul Technical University, Turkey ? Full Professor, Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico ? Full Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria ? Full Professor, Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece ? Full Professor, IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria ? Full Professor, Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic ? Full Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, Hungary ? Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic ? Full Professor, Department Chair, IEEE Senior Member
- Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia ? Full Professor, Dean, IEEE Senior Member
IMPORTANT DATES:
Full Paper Submission: March 18, 2019 @ 6PM CET (EXTENDED DEADLINE)
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Early Registration and Payment: May 10, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 1, 2019
Conference: July 1-3, 2019
CONTACTS:
For more information please visit the Conference website at http://tsp.vutbr.cz/. We are also ready to answer your questions emailed to tsp@feec.vutbr.cz .
Looking forward to meeting you in Budapest, Hungary.
With best regards,
Norbert Herencsar and Attila Vidacs
TSP 2019 General Co-Chairs
Web: http://tsp.vutbr.cz/
E-mail: tsp@feec.vutbr.cz
Follow us on:
- Facebook https://www.facebook.com/tspconf/
- Twitter https://twitter.com/tspconf/
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doc. Ing. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic
&
Assoc. Prof. Attila Vidacs, Ph.D.
Department of Telecommunications and Media Informatics
Faculty of Electrical Engineering and Informatics
Budapest University of Technology and Economics
Magyar tudosok korutja 2.
1117 Budapest
Hungary
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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. |
